Global Semiconductor Packaging Materials Market, By Packaging Material (Organic Substrate, Bonding Wire, Lead frame, Ceramic Package, Die Attach Material, Others), Wafer Material (Simple Semiconductor, Compound Semiconductor), Technology (Grid Array, Small Outline Package, Flat No-Leads Packages, Dual In-Line Package, Others), End User (Consumer Electronics, Automotive, Healthcare, IT and Telecommunication, Aerospace and Defence, Others) – Industry Trends and Forecast to 2029